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收藏宏聯在線留言站點地圖歡迎來到深圳市宏聯電路有限公司官方網站!專業線路板打樣,電路板打樣,pcb電路板,多層線路板,電路板廠,線路板廠!
宏聯電路-多樣化的PCB定制服務,精細化工藝,實力顯而易見
制程能力及檢測參數
Process?capability?and?checking?parameters
ITEM Technical capabilities
層次
Layers
2-32layers
最大尺寸
Max.Board Size
1200mm*610mm
79"*24"
板厚
Finished Board Thickness
0.25mm--10.0mm
0.001"--0.4"
銅厚
Finished?Copper?Thickness
17um-420um
0.5OZ--12OZ
最小線寬/線距
Min.Trace Width/Space
0.075mm/0.065mm
0.003"/0.0026"
最小孔徑
Min.Hole Size
0.1mm
0.006"
PTH孔孔徑差
Hole Dim. Tolerance(PTH)
±0.05mm
±0.002"
NPTH孔孔徑差
Hole Dim.Tolerance(NPTH)
±0.05mm
±0.002"
孔位公差
Drill Location Tolerance
±0.05mm
±0.002"
V-CUT角度
V-Score Degrees
20-90度
/
最小V-CUT板厚
Min.V-Score PCB Thickness
0.25mm
0.01"
外型公差
CNC Routing Tolerance
±0.1mm
±0.004"
最小盲/埋孔
Min.Blind/Buried Via
0.1mm
0.0039"
塞孔
Plug Hole Size
0.2mm--0.5mm
0.008"--0.02"
最小BGA
Min.BGA PAD
0.2mm
0.008"
材質
Materials
FR4板(指定品牌物料:如建滔、生益、聯茂、南亞、臺光臺耀等)、高頻板、鐵氟龍板、陶瓷板、羅杰斯板等等
FR4 (designated brand materials: such as KB, Shengyi, ITEQ, NANYA, EMC,CENS and so on), high frequency board, Teflon board, ceramic board, Rogers board and so on
表面處理
Surface Finish
無鉛噴錫,沉金,沉銀,沉錫,OSP,電厚金,沉金+OSP,噴錫+金手指,鎳鈀金,
LF-HASL,ENIG,ImAg,ImSn,OSP,Gold plating,ENIG+OSP,HASL+G/F,
翹曲度
Warp&Twist
≤0.75%
通斷測試
Electrical Testing
50--300V
可焊性試驗
Solderability Testing
245±5℃,3sec Wetting area least95%
熱沖擊試驗
Thermal Cycling Testing
288±5℃,10sec,3cycles
離子污染測試
Ionic Contamination Testing
Pb,Hg,Cd,Cr(VI),PBB,PBDE六項均小等于1000ppm
Pb,Hg,Cd,Cr(VI),PBB,PBDE?six items are less than 1000ppm
附著力測試
Soldmask Adhesion?Testing
260℃+/-5,10S,3times

特殊工藝

Special Technology

半孔、高Tg板、混壓板、無鹵素板、超薄超厚板、邦定、

阻抗、藍膠、碳油、電金、鎳鈀金、金手指、盲鑼、埋盲孔、沉頭孔、樹脂塞孔等.


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